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Foam Pad waffled, green, Ø 80 mm

[Item-No.: PW110]

The green waffled polishing foam has a diameter of 80 mm. Waffled polishing sponges result in even heat distribution and are particularly suitable for removing holograms.

  • Diameter: 80 mm (3,2 Inch)
  • Hardness: medium
  • Recessed Back: 5 mm
  • Surface: waffled
  • Color: green
  • open cells
  • ideal for holograms
  • Unit: 5 pieces