Foam Pad waffled, green, Ø 80 mm
[Item-No.: PW110]
The green waffled polishing foam has a diameter of 80 mm. Waffled polishing sponges result in even heat distribution and are particularly suitable for removing holograms.
- Diameter: 80 mm (3,2 Inch)
- Hardness: medium
- Recessed Back: 5 mm
- Surface: waffled
- Color: green
- open cells
- ideal for holograms
- SU: 5 pieces
